Advanced Plating Technologies, a Allied Industries, provides innovative and unsurpassed extensive expertise in functional and heavy build copper plating services to MIL-C-14550, AMS 2418 and ASTM B734. Advanced Plating Technologies offers both traditional alkaline cyanide copper plating services as well as non-cyanide alkaline copper plating and high-speed acid copper plating services for a wide range of engineering applications. Our company has precision barrel, rack and vibratory copper plating services which are currently employed in numerous industries including the ammunition, HVAC, power distribution, heat treatment, electronic, telecommunication and fastener industries.

Advanced Plating Technologies copper plating service company can be utilized as a final plate or as an underplate to subsequent deposits. Our company is able to perform tin plating, gold plating, silver plating and nickel plating deposits. APT also provides an unmatched capability in heavy build copper plating services with our company plating thicknesses up to 0.020 inches per side. Applications of heavy build copper plating services include the eddy current drives, lead, tungsten and frangible core bullets (reference Copper Bullet Plating in our Solutions in Surface Finishing section), braze fittings, coinage and heat treatment applications for a stop-off prior to carburizing or nitriding.

Advanced Plating Technologies can offer your company a proprietary tarnish inhibits in copper electroplating services to maintain a clean copper deposit. Unlike traditional “bright dips,” our monatomic inhibit minimizes oxidation and enhances subsequent brazing or soldering applications while ensuring low contact resistance of the copper deposit. This system can also be applied to raw copper components as well to enhance the appearance and functionality of copper deposits. An inhibited copper substrate or deposit will pass 24-hour high humidity testing, maximizing the shelf life and storage of products finished with our copper plating services. In addition, sealed nitrogen packaging can be provided for extended storage of copper deposits without the threat of surface oxidation or discoloration.